Lucintel’s latest market report analyzed that multi-layer FPC technology provides attractive opportunities in consumer electronic, automotive, aerospace and defense/military, and medical applications. The multi-layer FPC technology market is expected to reach $9.2 billion by 2028 with a CAGR of 9.7%. In this market, circuits with adhesive is the largest segment by product type, whereas consumer electronics is largest by application.
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Based on product type, the multi-layer FPC technology market is segmented into circuits with adhesives and circuits without adhesive. The circuits with adhesive segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, because they offer greater flexibility and versatility in terms of design and functionality, and they can be used to bond multiple layers of FPC together, creating a more complex and advanced circuits design.
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The Multi-Layer FPC Technology Market is marked by the presence of several big and small players. Some of the prominent players offering multi-layer FPC technology include Fujikura, Interflex, MFLEX, Tech-Etch, and Yamaichi Electronics.
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